IEC TS 62661-2-1:2013
Current
The latest, up-to-date edition.
Optical backplanes - Product specification - Part 2-1: Optical backplane using optical fibre circuit boards and multi-core right angle optical connectors
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
15-08-2013
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Dimensional requirements
5 Requirements for dual-star optical
circuits connection
6 Tests
7 Test report
8 Product qualification requirements
9 Reliability
Annex A (normative) - Mounting an optical backplane
to zone 3 of the advanced telecommunication
computing architecture (ATCA) backplane
Annex B (normative) - Specification for compact
right-angled optical board (CRO) connector
Bibliography
IEC/TS 62661-2-1:2013(E) gives guidelines for an optical backplane using optical fibre boards and multi-core right angle optical connectors with low bending loss multimode fibres (hereafter called low-loss RAO) to connect daughter boards to the optical backplane. Keywords: optical backplane, optical fibre boards, multi-core right angle optical connectors
| Committee |
TC 86
|
| DevelopmentNote |
Stability Date: 2021 (11/2017)
|
| DocumentType |
Technical Specification
|
| Pages |
38
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN NPR IEC/TS 62661-2-1 : 2013 | Identical |
| PD IEC/TS 62661-2-1:2013 | Identical |
| PD IEC/TR 62658:2013 | Roadmap of optical circuit boards and their related packaging technologies |
| CEI EN 62496-2 : 1ED 2017 | OPTICAL CIRCUIT BOARDS - BASIC TEST AND MEASUREMENT PROCEDURES - PART 2: GENERAL GUIDANCE FOR DEFINITION OF MEASUREMENT CONDITIONS FOR OPTICAL CHARACTERISTICS OF OPTICAL CIRCUIT BOARDS |
| IEC 62496-2:2017 | Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards |
| EN 62496-2:2017 | Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards |
| I.S. EN 62496-2:2017 | OPTICAL CIRCUIT BOARDS - BASIC TEST AND MEASUREMENT PROCEDURES - PART 2: GENERAL GUIDANCE FOR DEFINITION OF MEASUREMENT CONDITIONS FOR OPTICAL CHARACTERISTICS OF OPTICAL CIRCUIT BOARDS |
| IEC TR 62658:2013 | Roadmap of optical circuit boards and their related packaging technologies |
| BS EN 62496-2:2017 | Optical circuit boards. Basic test and measurement procedures General guidance for definition of measurement conditions for optical characteristics of optical circuit boards |
| 17/30315248 DC : 0 | BS EN 62496-2 ED 1.0 - OPTICAL CIRCUIT BOARDS - BASIC TEST AND MEASUREMENT PROCEDURES - PART 2: GENERAL GUIDANCE FOR DEFINITION OF MEASUREMENT CONDITIONS FOR OPTICAL CHARACTERISTICS OF OPTICAL CIRCUIT BOARDS |
| IEC 60297-3-101:2004 | Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units |
| IEC 62496-3-1:2009 | Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres |
| IEC 61300-2-1:2009 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-1: Tests - Vibration (sinusoidal) |
| IEC 61300-2-9:2017 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-9: Tests - Shock |
| IEC 61300-2-17:2010 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-17: Tests - Cold |
| IEC 61754-5:2005 | Fibre optic connector interfaces - Part 5: Type MT connector family |
| IEC 61300-2-18:2005 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-18: Tests - Dry heat - High temperature endurance |
| IEC 61300-2-22:2007 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-22: Tests - Change of temperature |
| IEC 61300-1:2016 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 1: General and guidance |
| IEC 62496-2-1:2011 | Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation |
| IEC 61300-3-6:2008 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-6: Examinations and measurements - Return loss |
| IEC 62496-3:2011 | Optical circuit boards - Part 3: Performance standards - General and guidance |
| IEC 61300-3-4:2012 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-4: Examinations and measurements - Attenuation |
| IEC 61300-2-2:2009 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-2: Tests - Mating durability |
| IEC 61754-25:2008 | Fibre optic connector interfaces - Part 25: Type RAO connector family |
| IEC 61300-2-19:2012 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-19: Tests - Damp heat (steady state) |
| IEC 60793-1-22:2001 | Optical fibres - Part 1-22: Measurement methods and test procedures - Length measurement |
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