IEEE 1386 AND 1386.1 : 2001

1 Overview
  1.1 Scope
  1.2 Purpose
  1.3 General arrangement
  1.4 Theory and operation of usage
  1.5 Parent-child standard
  1.6 Conformance
  1.7 Dimensions
  1.8 Coordinate dimensions
2 References
  2.1 Trademarks
  2.2 Relationship between VME, VMEbus, VME64, VME64x,
       and CompactPCI
3 Definitions, abbreviations, and terminology
  3.1 Special word usage
  3.2 Definitions
  3.3 Abbreviations
  3.4 Dimensional nomenclature height, width, and depth
4 Mezzanine card mechanics
  4.1 CMC size designations and sizes
  4.2 EMC envelope
  4.3 CMC dimensions
  4.4 Voltage keying
  4.5 Connector pads and labeling
  4.6 CMC connector
  4.7 CMC connector assembled on a CMC
  4.8 CMC component heights
  4.9 CMC connector and standoff heights
  4.10 CMC bezel
  4.11 CMC test dimensions
  4.12 I/O capability
  4.13 Power consumption and dissipation
  4.14 Ground connections
  4.15 Electromagnetic compatibility
  4.16 Shock and vibration
  4.17 Environmental
  4.18 MTBF
  4.19 ESD design
  4.20 ESD kit
5 Host CMC slot mechanics
  5.1 Stacking height above the host PCB
  5.2 Host PCB mechanics
  5.3 Connector pads and labeling
  5.4 CMC connectors
  5.5 CMC connector assembled on a host
  5.6 Host board side 1 component height
  5.7 Extra shoulder for 13 mm hosts
  5.8 Voltage keying pins
  5.9 Host front panel or host face plate opening
  5.10 Filler panels
  5.11 Host test dimensions
  5.12 I/O capability
  5.13 Power dissipation
  5.14 Grounding connections
  5.15 Electromagnetic compatibility
  5.16 Environmental
6 Electrical and logical layers
  6.1 Connector utilization
  6.2 CMC connector pin assignments
  6.3 Rear I/O mapping
  6.4 BUSMODE signals