• There are no items in your cart

IEEE DRAFT 1386.2 : D2.0 APR 95

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

DRAFT PHYSICAL AND ENVIRONMENTAL LAYERS FOR SBUS MEZZANINE CARDS: SMC

Withdrawn date

10-12-1996

Published date

12-01-2013

1 Overview
1.1 Scope
1.2 Purpose
1.3 General arrangement
1.4 Dimensions
2 References
3 Definitions, abbreviations and terminology
3.1 Special word usage
4 Mechanics and compliance
4.1 Conformance
4.2 SMC mechanical keying
4.3 SMC connector configurations
4.4 Power consumption, heat dissipation and air flow
4.5 Electromagnetic compatibility
4.6 Shock and vibration
4.7 Environmental
4.8 MTBF
5 Electrical and logical layers
5.1 Connector utilization
5.2 SBus connector pinout
5.3 Comparison of pin usage, SBus to SMC
List of figures
Figure 1-1 Typical SMC mounted to a host module
Figure 5-1 Connector orientation on SMC, Side 1
Figure 5-2 Connector orientation on hose, Side 1
List of tables
Table 5-1 SBus mezzanine card pinouts
Table 5-2 Pin use comparison, SBus to SMC (single size)

Defines the physical and environmental layers of a SBus Mezzanine Card (SMC) family to be usable on (but not limited to) single slot VME boards, single slot Futurebus+ modules, low profile desktop computers and similar types of applications.

DocumentType
Draft
PublisherName
Institute of Electrical & Electronics Engineers
Status
Withdrawn

IEEE DRAFT 1386 : D2.2 APR 2000 PHYSICAL AND ENVIRONMENTAL LAYERS FOR SBUS MEZZANINE CARDS: CMC

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.