IEEE DRAFT 896.10 : D4.0 JUL 95

CLAUSE
1. OVERVIEW
    1.1 Scope
    1.2 Applicability
    1.3 How to use this standard
    1.4 Why use this standard
2. APPLICABLE DOCUMENTS
    2.1 Referenced documents
3. DEFINITIONS
    3.1 Special word usage
    3.2 Bus line and signal conditions
    3.3 Futurebus + terminology
    3.4 Conventions
    3.5 Syntax
    3.6 Futurebus + logo
4. PROFILE S REFERENCE SPECIFICATION
    4.1 Introduction
    4.2 Target Applications
    4.3 Reference tables
    4.4 Profile S Interoperability
    4.5 Conformance testing
5. DETAILED SPECIFICATION, FUTUREBUS + LOGICAL LAYER
    5.1 Arbitration
    5.2 Parallel Protocol
6. UTILITY SIGNALS
    6.1 User console interface (UCIF) master present
    6.2 Trigger (TR1) and trigger 2 (TR2)
    6.3 Run
    6.4 Nuclear event direct
    6.5 Power failure imminent
    6.6 Power normal
    6.7 Warmstart
7. FAULT TOLERANCE ASPECTS OF THE PARALLEL PROTOCOL AND
    UTILITY SIGNALS
    7.1 Error detection
    7.2 Error isolation, logging and diagnostics
    7.3 Error removal and recovery
8. SERIAL BUS
    8.1 Serial bus physical layer
    8.2 Serial bus link layer
    8.3 Serial bus transaction layer
9. BUS/NODE MANAGEMENT AND CSRS
    9.1 Addressing
    9.2 Byte-lane wiring and byte ordering
    9.3 CSRs
    9.4 Futerers + CSRs
    9.5 Unit space CSRs
    9.6 Conflicting standards
    9.7 Serial bus management
    9.8 Private space
    9.9 Interrupts
    9.10 Diagnostics and test
    9.11 Monarch selection
10. DETAILED SPECIFICATION, PHYSICAL LAYER - SEM-E
    STRETCH
    10.1 Mechanical
    10.2 Input/output
    10.3 Profile connector, power and signal pin
11. DETAILED SPECIFICATION, PHYSICAL LAYER - 10 SU
    11.1 Mechanical
    11.2 Input/output
    11.3 Profile connector, power and signal pin
         assignments
12. PROFILE ELECTRICAL
    12.1 Backplane characteristics and design
         requirements
    12.2 Module electrical characteristics and design
         requirements
13. PROFILE S POWER
    13.1 Module power
    13.2 Host system power supplies
14. PROFILE S ENVIRONMENTAL SPECIFICATIONS
    14.1 System environment requirements
    14.2 Module environment requirements
15. RECOMMENDED PRACTICES
    15.1 Thermal considerations
    15.2 Power consumption
    15.3 Pinouts
    15.4 Bus performance analysis
    15.5 Bandwidth considerations
16. PROFILE S MODULE SELECTION CRITERIA
    16.1 Introduction
    16.2 Profile S modules
    16.3 Profile S systems
17. ALTERNATE PROFILE S MODULE CONNECTOR
ANNEX A. BIBLIOGRAPHY

Establishes a modular open architecture for spaceborne computing systems employing digital computers, processors, and other electronic modules. It provides for the integration and interoperability of diverse sets of electronic modules for the purpose of configuring various types of spaceborne computer systems. Specifies the electrical, logical, mechanical, thermal, and input/output interfaces necessary to allow modules, developed to this standard, to operate together in an integrated system or subsystem. In particular, the issues unique to spaceborne systems, such as size, weight, power, environment, reliability, and fault tolerance, are addressed.