IEEE/IEC 63055-2023
Current
Current
The latest, up-to-date edition.
IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
19-10-2023
This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected.
Committee |
Design Automation
|
DocumentType |
Standard
|
ISBN |
979-8-8557-0216-3
|
Pages |
298
|
PublisherName |
Institute of Electrical & Electronics Engineers
|
Status |
Current
|
IEEE 1364-2005 | IEEE Standard for Verilog Hardware Description Language |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.