IEEE/IEC 63055-2023
Current
Current
The latest, up-to-date edition.
IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
19-10-2023
This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected.
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