IPC 0040 : 0

1 SCOPE
   1.1 Purpose
   1.2 Categorization
   1.3 Classification of Products
   1.4 Applicable Documents
2 TECHNOLOGY OVERVIEW
   2.1 Optoelectronics in Optical Communication Systems
   2.2 History of Optoelectronic Packaging
   2.3 Optoelectronic Modules
   2.4 Packaging and Hermeticity
   2.5 Theory of Optical Fiber
   2.6 Automation Requirements
3 APPLICATIONS OF OPTOELECTRONIC PRODUCTS
   3.1 Consumer Products (Previously Low Cost)
   3.2 High Performance (Office and Large Business Systems)
   3.3 Portable Products
   3.4 Harsh Environments
4 DESIGN CONSIDERATIONS
   4.1 Level 1 Design Consideration
   4.2 Level 1 Components
   4.3 Level 1C Design Consideration
   4.4 Packaging Level 2
   4.5 Packaging Level 3
5 COMPONENTS (ELEMENTS AND MATERIALS)
   5.1 Level 1 Components
   5.2 Level 2 Type Components
   5.3 Level 3 System Integration Components
6 MATERIAL PROPERTIES
   6.1 Optical Materials
   6.2 Attachment Material
   6.3 Substrate Material
   6.4 Heat Transfer Materials
   6.5 Housing Materials
7 ASSEMBLY PROCESSES
   7.1 Assembly Process Overview
   7.2 Die and Component Bonding
   7.3 Electrical Connection to Components
   7.4 Encapsulation
   7.5 Fiber Sealing in a Hermetic Assembly
   7.6 Substrate Preparation for Level 1 and Level 2
   7.7 Optical Fiber Splicing (Mechanical/Fusion)
   7.8 Electrical Attachment
   7.9 Fiber Termination
   7.10 Fiber Management
   7.11 Mechanical Assembly
   7.12 In-Circuit and Functional Test
   7.13 HAST Test
   7.14 Modification and Rework
8 TESTING TECHNIQUES
   8.1 Insertion Loss Measurement
   8.2 Splice Loss Measurement Via OTDR
   8.3 Splice Loss Measurement Via Power Source and Meter
9 RELIABILITY REQUIREMENTS
   9.1 Optical Safety Precautions
   9.2 General Requirements
   9.3 Cleanliness
   9.4 Mechanical Integrity Tests
   9.5 Endurance
   9.6 Special Tests (Level 1 Components)
   9.7 Level 2 Products (Subassemblies) Reliability Tests
10 STANDARDIZATION
   10.1 Standards for Development
APPENDIX A Bibliography
APPENDIX B Glossary
APPENDIX C Standards Development Organizations and Other
           Related Associations Involved in the Area of
           Optoelectronics
APPENDIX D IEC Standards in the Area of Optoelectronics
APPENDIX E Telcordia Technologies
APPENDIX F Japan Industrial Standards
APPENDIX G Military Standards
APPENDIX H JEDEC Standards
APPENDIX I NIST Documents
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Covers the implementation of optical and optoelectronic packaging technologies.