IPC-2226A:2017
Current
Current
The latest, up-to-date edition.
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
Available format(s)
Hardcopy
Language(s)
English
Published date
09-01-2017
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-324-6
|
| Pages |
48
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
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