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IPC-2226A:2017

Current

Current

The latest, up-to-date edition.

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

Published date

09-01-2017

This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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