IPC 7094A : 2018
Current
Current
The latest, up-to-date edition.
IPC-7094A: Design and Assembly Process Implementation for Flip Chip and Die-Size Components - English
Available format(s)
Hardcopy
Language(s)
English
Published date
01-01-2018
Publisher
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.