IPC 9850 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SURFACE MOUNT PLACEMENT EQUIPMENT CHARACTERIZATION
Hardcopy
23-07-2013
English
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 INTRODUCTION
2 REFERENCED DOCUMENTS
3 PLACEMENT PERFORMANCE METRIC
4 LINE SUMMARY FORM IPC-9850-F
5 MEASUREMENT SYSTEM ANALYSIS (MSA) CAPABILITY-FORM
IPC-9850-F3
6 TEST VEHICLES
7 FORMS AND DIAGRAMS
Appendix A - Capability Indexes
Appendix B - Specification Limits for Cpk Values
Appendix C - Guidelines for Adhesive Used for Machine
Capability Testing (Selection and Application)
Appendix D - Suggested Methodologies for Measuring
Components Using an Optical CMM
Appendix E - Component Centroid Locations for Panel
Population (relative to the lower left
fiducial)
Appendix F - Component Location for CMM Verification
Panel
Appendix G - How to Perform a GR&R Test Instruction
for Using the Gauge R&R Spreadsheet
Appendix H - Reliability and Utilization Definitions
Appendix I - Placement Verification Panel Carrier
Appendix J - Instruction for Using The IPC-9850-MLTE.xls
Spreadsheets
Sets up the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine's placement capability and conformance to the specification while maintaining placement accuracy to placement throughput relationship.
| DevelopmentNote |
Includes one printed copy of the standard and a CD with support documentation. (12/2011) Also available in CD-ROM format. (07/2013)
|
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC 9262 : 2016 | SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
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