IPC J STD 006 : C
Current
The latest, up-to-date edition.
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
English, Japanese
12-08-2013
1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
Appendix A - Solder Alloys
Appendix B - Examples of Inspection
Report Format
Appendix B-1 - Test Report for Solder Alloy Composition
and Impurity Level
Appendix B-2 - Inspection Report for Fluxed
Wire/Ribbon Solder Individual
Inspection and Test Results
Appendix B-3 - Inspection Report for Non-Fluxed Solder
Individual Inspection and Test Results
Appendix B-4 - Inspection Report for
Solder Powder
Describes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for 'special form' electronic grade solders.
| Committee |
5-20
|
| DevelopmentNote |
Supersedes MIL F 14256, QQ S 571, QPL 14256 & QPL QQ S 571. (07/2004) Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000. B2006 + A1 2008 Edition is still available in Japanese Language, See J STD 006 JAPANESE. (10/2009) B2006 + A2 2009 Edition is still available in Russian Language, See separate record (12/2011) Also available in Chinese Language, See J STD 006 CHINESE. (04/2014)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-104-4
|
| Pages |
32
|
| ProductNote |
NEW CHILD AMD 1 2017 IS NOW ADDED
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |