IPC J STD 006 : C
Current
The latest, up-to-date edition.
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Hardcopy
English
12-08-2013
1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
Appendix A - Solder Alloys
Appendix B - Examples of Inspection
Report Format
Appendix B-1 - Test Report for Solder Alloy Composition
and Impurity Level
Appendix B-2 - Inspection Report for Fluxed
Wire/Ribbon Solder Individual
Inspection and Test Results
Appendix B-3 - Inspection Report for Non-Fluxed Solder
Individual Inspection and Test Results
Appendix B-4 - Inspection Report for
Solder Powder
Describes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for 'special form' electronic grade solders.
Committee |
5-20
|
DevelopmentNote |
Supersedes MIL F 14256, QQ S 571, QPL 14256 & QPL QQ S 571. (07/2004) Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000. B2006 + A1 2008 Edition is still available in Japanese Language, See J STD 006 JAPANESE. (10/2009) B2006 + A2 2009 Edition is still available in Russian Language, See separate record (12/2011) Also available in Chinese Language, See J STD 006 CHINESE. (04/2014)
|
DocumentType |
Standard
|
ISBN |
978-1-61193-104-4
|
Pages |
34
|
ProductNote |
NEW CHILD AMD 1 2017 IS NOW ADDED
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
Supersedes |
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IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
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EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
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IPC LDFR0605-CD : 2005 | IPC/SOLDERTEC 3RD INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONICS "TOWARDS IMPLEMENTATION OF THE ROHS DIRECTIVE" |
IPC LDFR1005-CD : 2005 | IPC/JEDEC 11TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES |
IPC LDFR1106-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND" |
IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
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IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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MIL-DTL-1716 Revision J:1997 | POLE, TENT, TELESCOPIC, ADJUSTABLE 5 FEET TO 9 FEET, MAGNESIUM |
IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
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IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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PPP-B-1672 Revision E:2013 | BOXES, SHIPPING, REUSABLE WITH CUSHIONING |
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IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
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MIL-DTL-16878 Revision H:2012 | WIRE, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR |
MIL-DTL-25516 Revision F:2004 | CONNECTORS, ELECTRICAL, MINIATURE, COAXIAL, ENVIRONMENT RESISTANT TYPE, GENERAL SPECIFICATION FOR |
MIL-DTL-83513-18 Revision D:2009 | Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 4 Row, Solder Type, Standard Profile, 100 Contacts, Printed Circuit Board |
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MIL R 27208 : D | RESISTOR, VARIABLE, WIRE-WOUND, NONPRECISION, GENERAL SPECIFICATION FOR |
MIL F 28861 : B | FILTER AND CAPACITOR, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR |
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AWS WHC2.13 : 0 | WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING |
MIL-DTL-83513-26 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD |
MIL-DTL-3976 Revision F:2013 | Lights, Marker, Clearance (Service and Blackout) General Specification for |
MIL-DTL-83513-10 Revision D:2008 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
MIL-PRF-28861 Revision E:2016 | FILTERS AND CAPACITORS, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR |
MIL-DTL-21567 Revision B:2009 | COMPOUND, SILICONE, SOFT FILM |
MIL R 94 : E | RESISTORS, VARIABLE, COMPOSITION, GENERAL SPECIFICATION FOR |
MIL-PRF-81705 Revision E:2009 | Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable |
MS90908 Revision C:2011 | FILLER TUBE, FUEL TANK - MILITARY VEHICLES |
PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
13/30295427 DC : 0 | BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
MIL-DTL-5015 Revision H:2000 | CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE - GENERAL SPECIFICATION FOR |
IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
MIL-DTL-28754-14 Revision D:2014 | Connectors, Electrical, Modular, Connector, Type IV, 20 Contact, Right Angle (for Die Cast Frame) |
MIL-DTL-26482 Revision H:2007 | Connectors, Electrical, Circular, Miniature, Quick Disconnect, Environment Resisting, Receptacles and Plugs, General Specification for |
MIL-DTL-28748-21 Base Document:2005 | Connectors, Electrical, Rectangular, Rack and Panel, Printed Wiring Board (PWB) Mount, Right Angle, Socket Contacts, Size 22 |
MIL-PRF-6864 Revision F:2010 | CLEANING COMPOUND, SOLVENT, OIL COOLER |
MIL-DTL-32234 Base Document:2007 | CONNECTORS, ELECTRICAL, ULTRA HIGH DENSITY, MODULAR, BLADE AND FORK, EIGHT ROW, GENERAL SPECIFICATION FOR |
MIL-DTL-83513-31 Revision B:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATUREE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
MIL-DTL-83513-16 Revision D:2009 | Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 2 Row, Solder Type, Standard Profile, 9 Through 37 Contacts, Printed Circuit Board |
MIL-DTL-83513-14 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD |
MIL-PRF-22097 Revision J:2007 | RESISTOR, VARIABLE, NONWIREWOUND, ADJUSTMENT TYPE, GENERAL SPECIFICATION FOR |
IPC TR 582 : 0 | CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR |
MIL-PRF-32560 Base Document:2016 | COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
SAE AMS P 81728 : 2015 | PLATING, TIN-LEAD (ELECTRODEPOSITED) |
GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
MIL-DTL-39024 Revision C:2014 | JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR |
NASA STD 8739.3 : 1998 | SOLDERED ELECTRICAL CONNECTIONS |
MIL-STD-981 Revision C:2010 | DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS |
NASA MSFC STD 2907 : 2006 | WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
MIL-B-49030 Revision A:2010 | BATTERIES, DRY (ALKALINE) |
NASA KSC SPEC E 0031 : 2008 | CABLES, ELECTRICAL, SPECIFICATION FOR |
GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
MIL-DTL-28754-47 Revision C:2015 | CONNECTORS, ELECTRICAL MODULAR, TYPE 4, CONNECTOR, 100 PIN, RIGHT ANGLE CONTACT TAILS ON .100 CENTERS |
GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
NASA KSC SPEC E 0024 : 2008 | CABLE, ELECTRICAL, SHIELDED, JACKETED, FOR HARNESS ASSEMBLIES, GENERAL SPECIFICATION FOR |
NASA STD 8739.2 : 1999 | WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY |
IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
MIL-STD-186 Revision F:2002 | PROTECTIVE FINISHING SYSTEMS FOR ROCKETS, GUIDED MISSILES, SUPPORT EQUIPMENT AND RELATED MATERIALS |
MIL-DTL-28754-10 Revision D:2014 | Connectors, Electrical, Modular, Connector, Type IV, 40 Pin, Contact Tails on 0.050 Centers |
MIL-DTL-28754-101 Revision A:2015 | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 0.6 PITCH, 250 CONTACT, CENTER |
MIL-DTL-24308 Revision G:2009 | Connectors, Electric, Rectangular, Nonenvironmental, Miniature, Polarized Shell, Rack and Panel, General Specification for |
MIL-PRF-31033 Revision B:2011 | Capacitor, Fixed, Ceramic Dielectric, High Reliability, Discoidal, General Specification for |
MIL-DTL-83513-12 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD |
MIL-DTL-8416 Revision C:2005 | ADAPTER, HEADSET-MICROPHONE MX-1646()/AIC |
MIL-DTL-83513-11 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD |
MIL-DTL-5794 Revision C:2006 | MICROPHONE UNIT M-6A/UR AND MICROPHONE, CARBON M-51/UR (CARBON NOISE CANCELING) |
MIL L 12632 : D | LOUDSPEAKER, PERMANENT MAGNET (ENCASED, 2 WATT, FUNGUS, GUNBLAST, AND IMMERSION RESISTANT), GENERAL SPECIFICATION FOR |
MIL-DTL-27434 Revision B:2003 | ADAPTERS, CONNECTOR, COAXIAL, RADIO FREQUENCY, BETWEEN SERIES, GENERAL SPECIFICATION FOR |
MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
MIL-DTL-76 Revision E:2016 | WIRE AND CABLE, HOOKUP, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR |
AWS C3.11M/C3.11:2011 | SPECIFICATION FOR TORCH SOLDERING |
MIL-DTL-10986 Revision G:2007 | INDICATORS AND TRANSMITTERS: LIQUID, TEMPERATURE AND PRESSURE |
MIL-PRF-29607 Base Document:1996 | CLEANING COMPOUND, AVIONICS COMPONENTS, NON-OZONE DEPLETING |
MIL-DTL-83513-15 Revision E:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKETS CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD |
SAE AS 39029 : 2017 | CONTACTS, ELECTRICAL CONNECTOR, GENERAL SPECIFICATION FOR |
SAE AS 50151 : 2015 | CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE, GENERAL SPECIFICATION FOR |
SAE AS 4461 : 2016 | ASSEMBLY AND SOLDERING CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING WIRE AND CABLE TERMINATION IN AEROSPACE VEHICLES |
IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
MIL-STD-202-210 Base Document:2015 | METHOD 210, RESISTANCE TO SOLDERING HEAT |
IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
IEC PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
MIL-DTL-28754-100 Revision A:2015 | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 200 CONTACT, CENTER |
MIL-DTL-28754-61 Revision A:2016 | Connectors, Electrical, Modular, Type IV, Connector, 100 Pin, Center, Crossover, Contact Tails on .100 Centers (Ceramic Compatible) |
MIL-DTL-83513-28 Revision B:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
MIL-DTL-55235 Revision A:2003 | CONNECTORS, COAXIAL, RADIO FREQUENCY, SERIES TPS, GENERAL SPECIFICATION |
MIL-DTL-21617 Revision B:2012 | CONNECTORS, PLUG AND RECEPTACLE, ELECTRICAL, RECTANGULAR, POLARIZED SHELL, MINIATURE TYPE, GENERAL SPECIFICATION FOR |
MIL-DTL-83502 Revision E:2007 | Sockets, Plug-in Electronic Components, Round Style, General Specification for |
MIL-DTL-28748-20 Base Document:2005 | Connectors, Electrical, Rectangular, Rack and Panel, Printed Wiring Board (PWB) Mount, Right Angle, Pin Contacts, Size 22 |
MIL-DTL-3655 Revision D:2004 | Connector, Plug and Receptacle, Electrical (Coaxial, Series Twin), and Associated Fittings, General Specification for |
MIL-DTL-55302-83 Revision C:2004 | CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, PIN CONTACTS, 41, 66, 114 CONTACT POSITIONS: FOR PRINTED WIRING BOARDS (.100 X .050 OFFSET GRID) |
SAE AS 95234 : 2014 | CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR |
SAE AS 29600 : 2017 | CONNECTORS, ELECTRICAL, CIRCULAR, MINIATURE, COMPOSITE, HIGH DENSITY, QUICK COUPLING, ENVIRONMENT RESISTANT, REMOVABLE CRIMP CONTACTS ASSOCIATED HARDWARE, GENERAL SPECIFICATION FOR |
MIL-DTL-83513-20 Revision D:2009 | Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Right Angle, Socket Contacts, 3 Row, Solder Type, Standard Profile, 51 Contacts, Printed Circuit Board |
MIL-DTL-3643 Revision B:2003 | Connectors, Coaxial, Radio Frequency, Series HN, and Associated Fittings, General Specification for |
MIL-DTL-3650 Revision B:2003 | Connectors, Coaxial, Radio Frequency, Series LC |
EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
MS35644 Revision G:2011 | FILLER NECK: FUEL TANK - MILITARY VEHICLES |
PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
DSCC 99002 : A | TRANSFORMER, SWITCHING |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
MIL-DTL-18714 Revision F:2012 | PRIMER, ELECTRIC, MARK 45 MOD 1 |
EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
DSCC 03024 : C | SHIELDING BEAD, ELECTRONIC, CHIP, FERRITE, HIGH RELIABILITY |
IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
IPC TM 650 : 0 | TEST METHODS MANUAL |
IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
ISO 9001:2015 | Quality management systems — Requirements |
ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
ISO 10012-1:1992 | Quality assurance requirements for measuring equipment Part 1: Metrological confirmation system for measuring equipment |
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