IPC J-STD-075 : 2008
Current
Current
The latest, up-to-date edition.
Classification of Non-IC Electronic Components for Assembly Processes
Available format(s)
Hardcopy
Language(s)
English
Published date
09-03-2008
Publisher
J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components.
DocumentType |
Standard
|
Pages |
12
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
Supersedes |
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