IPC/JEDEC-J-STD-609C:2025

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: 1. those assemblies that are assembled with lead-containing or lead-free solder; 2. components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3. the maximum component temperature not to be exceeded during assembly or rework processing; 4. the base materials used in the PCB construction, including those PCBs that use halogen-free resin; 5. the surface finish of PCBs; and the conformal coating on PCBAs.