IPC ML 960 : 0
Current
The latest, up-to-date edition.
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR MASS LAMINATION PANELS FOR MULTILAYER PRINTED BOARDS
Hardcopy
English
01-07-1994
1.0 SCOPE
1.1 Purpose
1.2 Classification
1.3 Dimensions and Tolerances
1.4 Statistical Process Control (SPC)
1.5 Interpretation
2.0 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Military
2.3 Other Publications
3.0 REQUIREMENTS
3.1 General
3.2 Terms and Definitions
3.3 Conflict
3.4 Qualification and Performance
3.5 Material
3.6 Visual Examination
3.7 Board Dimensional Requirements
3.8 Conductor Definition
3.9 Bond Strength, Outer Layer Copper
3.10 Construction Integrity
3.11 Electrical Requirements
3.12 Repair
4.0 QUALITY ASSURANCE PROVISIONS
4.1 Responsibility for Inspection
4.2 Categories of Inspection
4.3 Qualification Testing
4.4 Artwork Inspection
4.5 Materials Inspection
4.6 Inspection of Product for Delivery
4.7 Methods of Inspection
4.8 Statistical Process Control (SPC)
5.0 PREPARATION FOR DELIVERY
5.1 Packaging
5.2 Marking
6.0 NOTES
6.1 Ordering Data
Tables
Covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are also addressed.
| DevelopmentNote |
Included in IPC C 105 & IPC C 1000. (08/2008)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC M 105 : LATEST | RIGID PRINTED BOARD MANUAL |
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