IPC ROADMAP-09 : 2009
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
2008-2009 INTERNATIONAL TECHNOLOGY ROADMAP FOR ELECTRONIC INTERCONNECTIONS
25-05-2016
23-11-2012
Part A - How to Use This Roadmap
Section 1 - Roadmap Organizational Structure
Section 2 - OEM Requirements and Expectations
Section 3 - Technology Verification Techniques
Part B - Technology Trends
Section 1 - Semiconductor Packaging
Section 2 - Interconnection Technology
Section 3 - Integral and Integrated Electronics
Section 4 - Connector and Sockets
Section 5 - Environmental Issues
Part C - Design Considerations and Concerns
Section 1 - System Architecture Requirements
Section 2 - Standards, Tools and Technologies
Section 3 - Electronic Data Documentation
Section 4 - Box Build and Intra-connection
Part D - Component Packaging
Section 1 - Component Substrate
Section 2 - Component Assembly Considerations
Section 3 - Testing and Reliability Expectations
Part E - Substrates Technology Other Than Packaging
Section 1 - Rigid Organic Products (modules, boards,
backplanes)
Section 2 - Flexible Organic Products (modules, boards)
Section 3 - Unique Interconnection Methods (modules,
boards, backplanes)
Part F - Assembly Technology Other Than Packaging
Section 1 - Rigid Organic Assemblies
Section 2 - Flexible Organic Assemblies
Section 3 - Unique Assembly Methods
Part G - Appendix
Section 1 - Industry Standards
Section 2 - Emulator Analysis
Section 3 - Resource Information
Section 4 - Definitions and Acronyms
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