IPC ROADMAP-09 : 2009

Part A - How to Use This Roadmap
  Section 1 - Roadmap Organizational Structure
  Section 2 - OEM Requirements and Expectations
  Section 3 - Technology Verification Techniques
Part B - Technology Trends
  Section 1 - Semiconductor Packaging
  Section 2 - Interconnection Technology
  Section 3 - Integral and Integrated Electronics
  Section 4 - Connector and Sockets
  Section 5 - Environmental Issues
Part C - Design Considerations and Concerns
  Section 1 - System Architecture Requirements
  Section 2 - Standards, Tools and Technologies
  Section 3 - Electronic Data Documentation
  Section 4 - Box Build and Intra-connection
Part D - Component Packaging
  Section 1 - Component Substrate
  Section 2 - Component Assembly Considerations
  Section 3 - Testing and Reliability Expectations
Part E - Substrates Technology Other Than Packaging
  Section 1 - Rigid Organic Products (modules, boards,
              backplanes)
  Section 2 - Flexible Organic Products (modules, boards)
  Section 3 - Unique Interconnection Methods (modules,
              boards, backplanes)
Part F - Assembly Technology Other Than Packaging
  Section 1 - Rigid Organic Assemblies
  Section 2 - Flexible Organic Assemblies
  Section 3 - Unique Assembly Methods
Part G - Appendix
  Section 1 - Industry Standards
  Section 2 - Emulator Analysis
  Section 3 - Resource Information
  Section 4 - Definitions and Acronyms

Specifies vision and direction for product development, process development and services required to satisfy the current and future needs of companies who are building electronic equipment for global customer requirements.