IPC TMRC03T : 2003
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
TECHNOLOGY TRENDS FOR PRINTED CIRCUIT BOARDS
Superseded date
01-11-2007
Superseded by
Published date
12-01-2013
Publisher
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Provide details on trends in conductor width and spacing, metallic finishes and solder mask usage; also trends in multilayer production, laminate thickness and temperature, surface mounting and fine pitch technology.
| DevelopmentNote |
Also available in CD-ROM. (02/2005)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC TMRC04T : 2005 | TECHNOLOGY TRENDS FOR PRINTED CIRCUIT BOARDS FOR THE YEAR 2004 |
| IPC EMTF 06T : 2006 | TECHNOLOGY TRENDS FOR PRINTED CIRCUIT BOARDS FOR THE YEAR 2005 |
| IPC TMRC01T : 2001 | TECHNOLOGY TRENDS FOR RIGID PRINTED CIRCUIT BOARDS |
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