IPC TR 001 : 2006
Current
Current
The latest, up-to-date edition.
An Introduction to Tape Automated Bonding Fine Pitch Technology
Available format(s)
Hardcopy
Language(s)
English
Published date
01-01-2006
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules.
| DocumentType |
Technical Report
|
| Pages |
38
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
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