IPC TR 001 : 2006
Current
Current
The latest, up-to-date edition.
An Introduction to Tape Automated Bonding Fine Pitch Technology
Published date
01-01-2006
Publisher
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This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules.
| DocumentType |
Technical Report
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Current
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| Supersedes |
Summarise
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