ISO 9453:2020
Current
Current
The latest, up-to-date edition.
Soft solder alloys Chemical compositions and forms
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English, French
Published date
24-09-2020
Important note : Users cannot be edited or removed once added to your Multi user PDF.
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
International Organization for Standardization
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NS-EN ISO 9453:2020 | Identical |
| UNI EN ISO 9453:2021 | Identical |
| DIN EN ISO 9453:2021-01 | Identical |
| ÖNORM EN ISO 9453:2021 04 01 | Identical |
| PN-EN ISO 9453:2021-04 | Identical |
| I.S. EN ISO 9453:2020 | Identical |
| NF EN ISO 9453:2020 | Identical |
| UNE-EN ISO 9453:2021 | Identical |
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