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  • ISO 9455-1:1990

    Current The latest, up-to-date edition.

    Soft soldering fluxes Test methods Part 1: Determination of non-volatile matter, gravimetric method

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, French

    Published date:  15-11-1990

    Publisher:  International Organization for Standardization

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    Abstract - (Show below) - (Hide below)

    Specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. Applies to liquid and paste fluxes of type 1, as defined in ISO 9454-1.

    General Product Information - (Show below) - (Hide below)

    Committee ISO/TC 44/SC 12
    Development Note Also numbered as BS EN 29455-1 (10/2005)
    Document Type Standard
    Publisher International Organization for Standardization
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    DIN EN ISO 9455-5 E : 2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014)
    14/30309692 DC : 0 BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS
    DIN EN ISO 9454-1 E : 2016 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016)
    BS IEC 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    BS EN ISO 9454-1 : 2016 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING
    12/30274804 DC : 0 BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE
    BS EN 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    16/30337155 DC : 0 BS EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES
    BS EN 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    IEEE DRAFT 1003.1Q : D8 2000 DRAFT STANDARD FOR INFORMATION TECHNOLOGY-PORTABLE OPERATING SYSTEMS INTERFACE (POSIX) - PART 1: SYSTEM APPLICATION PROGRAM INTERFACE (API) - AMENDMENT X: TRACING (C LANGUAGE)
    BS EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    BS EN 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    BS IEC 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    14/30285529 DC : 0 BS EN ISO 9454-1 - SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING
    16/30337159 DC : 0 BS EN ISO 9455-15 - SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST
    NBR IEC 61189-5 : 2012 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTIONS STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    BS IEC 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    UNE-EN ISO 9455-5:2015 Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014)
    DIN EN ISO 9455-5:2014-10 Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014)
    BS EN ISO 9455-15 : 2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017)
    12/30274800 DC : 0 BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE
    BS EN ISO 9455-14 : 2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017)
    BS EN ISO 9455-5:2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST
    CEI EN 61189-5-2 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    UNI EN ISO 9455-5 : 2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST
    DIN EN ISO 9454-1:2016-07 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016)
    UNE-EN ISO 9454-1:2016 Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016)
    I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    I.S. EN ISO 9455-14:2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017)
    I.S. EN 61189-5-3:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    I.S. EN ISO 9455-5:2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014)
    I.S. EN ISO 9455-15:2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017)
    I.S. EN ISO 9454-1:2016 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016)
    I.S. EN 61189-5-2:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    EN ISO 9455-14 : 2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017)
    UNE-EN ISO 9455-14:2018 Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
    NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    EN ISO 9455-15:2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017)
    ISO 9455-15:2017 Soft soldering fluxes Test methods Part 15: Copper corrosion test
    12/30270787 DC : 0 BS EN ISO 9455-5 - SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST
    12/30274796 DC : 0 BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX
    I.S. EN 61189-5-4:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    ISO 9455-14:2017 Soft soldering fluxes Test methods Part 14: Assessment of tackiness of flux residues
    DIN EN ISO 9455-3:1994-11 SOFT SOLDERING FLUXES - TEST METHODS - PART 3: DETERMINATION OF ACID VALUE, POTENTIOMETRIC AND VISUAL TITRATION METHODS
    DIN EN ISO 9455-9:1995-11 Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:1993); German version EN ISO 9455-9:1995
    DIN EN ISO 9455-2:1995-11 SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD
    DIN EN ISO 9455-6:1997-03 SOFT SOLDERING FLUXES - TEST METHODS - PART 6: DETERMINATION AND DETECTION OF HALIDE (EXCLUDING FLUORIDE) CONTENT
    IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
    BS EN 61189-5-1 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
    BS EN 29454-1 : 1994 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    IEC 61189-5-4:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    BS EN ISO 9455-6 : 1997 SOFT SOLDERING FLUXES - TEST METHODS - PART 6: DETERMINATION AND DETECTION OF HALIDE (EXCLUDING FLUORIDE) CONTENT
    BS EN ISO 9454-2:2001 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
    BS EN ISO 9455-3:1995 SOFT SOLDERING FLUXES - TEST METHODS - PART 3: DETERMINATION OF ACID VALUE, POTENTIOMETRIC AND VISUAL TITRATION METHODS
    ISO 9455-3:1992 Soft soldering fluxes Test methods Part 3: Determination of acid value, potentiometric and visual titration methods
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    ISO 9455-5:2014 Soft soldering fluxes Test methods Part 5: Copper mirror test
    ISO 9455-6:1995 Soft soldering fluxes Test methods Part 6: Determination and detection of halide (excluding fluoride) content
    BS EN 29455-5 : 1993 SOFT SOLDERING FLUXES - TEST METHODS - COPPER MIRROR TEST
    EN ISO 9454-2 : 2000 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
    EN ISO 9455-5 : 2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014)
    I.S. EN ISO 9454-2:2000 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
    EN 61189-5-1 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
    ONORM EN ISO 9455-5 : 2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014)
    EN 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES (IEC 61189-5-4:2015)
    EN 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES (IEC 61189-5-3:2015)
    EN 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES (IEC 61189-5-2:2015)
    DIN EN ISO 9455-12:1994-11 SOFT SOLDERING FLUXES - TEST METHODS - PART 12: STEEL TUBE CORROSION TEST
    EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    EN 29455-5 : 1993 SOFT SOLDERING FLUXES - TEST METHODS - COPPER MIRROR TEST
    EN ISO 9455-6 : 1997 SOFT SOLDERING FLUXES - TEST METHODS - PART 6: DETERMINATION AND DETECTION OF HALIDE (EXCLUDING FLUORIDE) CONTENT
    EN ISO 9454-1 : 2016 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016)
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