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ISO/TS 10303-1682:2018

Current

Current

The latest, up-to-date edition.

Industrial automation systems and integration Product data representation and exchange Part 1682: Application module: Interconnect 2D shape

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English

Published date

18-12-2018

€60.00
Excluding VAT

ISO/TS 10303-1682:2018-11 specifies the application module for Interconnect 2D shape.

The following are within the scope of ISO/TS 10303-1682:2018-11:

  • embedded physical component location;
  • continuous planar feature shape definition.

DocumentType
Technical Specification
Pages
0
PublisherName
International Organization for Standardization
Status
Current
Supersedes

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