ISO/TS 10303-1685:2018
Current
Current
The latest, up-to-date edition.
Industrial automation systems and integration Product data representation and exchange Part 1685: Application module: Interconnect module to assembly module relationship
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English
Published date
18-12-2018
Important note : Users cannot be edited or removed once added to your Multi user PDF.
ISO/TS 10303-1685:2018-11 specifies the application module for Interconnect module to assembly module relationship.
The following are within the scope of ISO/TS 10303-1685:2018-11:
- assembly requirement for interconnect substrate;
- assembly component based symbol placement in substrate requirement;
- assembly component based annotation text placement in substrate requirement;
- assembly component feature to layout feature requirement relationship;
- external references for assembly component;
- external references for assembly component feature;
| DocumentType |
Technical Specification
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| Pages |
0
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| PublisherName |
International Organization for Standardization
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| Status |
Current
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| Supersedes |
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