ISO/TS 10303-1688:2010
Current
Current
The latest, up-to-date edition.
Industrial automation systems and integration Product data representation and exchange Part 1688: Application module: Interconnect non planar shape
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English
Published date
18-05-2010
ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape.
The following are within the scope of ISO/TS 10303-1688:2010-03:
- three dimensional manifold surface representation of an interconnect substrate;
- placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.
| DocumentType |
Technical Specification
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| Pages |
0
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| PublisherName |
International Organization for Standardization
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| Status |
Current
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| Supersedes |
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