ISO/TS 10303-1754:2010

ISO/TS 10303-1754:2010-03 specifies the application module for Via component.

The following are within the scope of ISO/TS 10303-1754:2010-03:

• blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
• cylinder vias, where the cross-section shape is constant;
• tapered vias, where the cross-section shape may vary as the vertical distance changes;
• stacked vias, where multiple bind and buried vias share the same x y position;
• filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
• buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
• interfacial connections, also known as through hole vias, which have both ends exposed;
• items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
• items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.