JEDEC JEP130C:2023
Current
Current
The latest, up-to-date edition.
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-02-2023
Publisher
This document establishes the guidelines for unit container packing of integrated circuits and for the next level of container.
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