JEDEC JEP154:2008(R2011)
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
Hardcopy , PDF
English
01-06-2011
16-03-2024
| Committee |
JC-14.1
|
| DocumentType |
Revision
|
| Pages |
34
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy |
This document describes a method to test the electromigration (EM) susceptibility of solder bumps,
including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The
method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the
advantages and concerns associated with EM testing, as well as options for data analysis. The tests are
performed on packaged bump electromigration test devices. The bump electromigration test techniques
described in this document can be used to assess the electromigration reliability of different types of
solder bumps and metallizations, to make materials decisions, and to establish maximum bump current
specifications. Thermal migration is also known to exist, but is outside the scope of this document.
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