JEDEC JEP154A.01:2025
Current
Current
The latest, up-to-date edition.
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress JEP154A.01
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-05-2025
Publisher
Free
Excluding VAT
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages.
| DocumentType |
Standard
|
| Pages |
48
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
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