JEDEC JEP154A:2024
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
Hardcopy , PDF
English
01-03-2024
18-07-2025
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages.
| DocumentType |
Standard
|
| Pages |
48
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
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