JEDEC JEP30-T100A:2023
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-03-2023
Publisher
Superseded date
02-04-2025
Superseded by
Free
Excluding VAT
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Revision
|
| Pages |
44
|
| ProductNote |
This standard also refers to JEP30-T101, JEP30-D10, JESD15-1, JESD51, JESD51-1, JEDEC JESD 51-6
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-M100:2025 | PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-S100A.02:2025 | Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30D:2024 | Part Model Guidelines for ElectronicDevice Packages – XML Requirements |
| JEDEC JESD 51-2A : 2008 | INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - NATURAL CONVECTION (STILL AIR) |
| JEDEC JEP 30:2018 | Part Model Guidelines for Electronic-Device Packages – XMLRequirements |
| JEDEC JESD30J:2022 | Descriptive Designation System for Electronic-device Packages and Footprints |
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