JEDEC JEP30-T100C:2025
Current
Current
The latest, up-to-date edition.
PartModel Thermal Guidelines for Electronic-Device Packages – XML Requirements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-09-2025
Publisher
Free
Excluding VAT
The JEP30 document establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| JEDEC JEP30F:2025 | PartModel Guidelines for ElectronicDevice Packages – XML Requirements |
| JEDEC JEP30-T100B.01:2025 | Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
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