JEDEC JEP30D:2024
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Part Model Guidelines for ElectronicDevice Packages – XML Requirements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-02-2024
Publisher
Superseded date
05-04-2025
Superseded by
Free
Excluding VAT
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
72
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-E100G:2025 | Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-A100A:2023 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-S100:2023 | Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JESD 99C:2012 | Terms, Definitions, and Letter Symbols for Microelectronic Devices |
| IEC 62474:2018+AMD1:2020 CSV | Material declaration for products of and for the electrotechnical industry |
| JEDEC JEP30-E100D:2024 | Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-T100A:2023 | Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
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