JEDEC JESD 22-A111B:2018
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-03-2018
Publisher
Superseded date
18-07-2025
Superseded by
Free
Excluding VAT
This evaluation procedure is written to provide users of ICs of small surface mount packages with a method to evaluate the capability of a device to withstand full wave solder immersion.
| Committee |
JC-14.1
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-A100B.01:2025 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JESD47J.01:2017 | Stress-Test-Driven Qualification of Integrated Circuits |
| JEDEC JESD 625B : 2012 | Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices |
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