JEDEC JESD 22-B116B : 2017
Current
Current
The latest, up-to-date edition.
WIRE BOND SHEAR TEST METHOD
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-04-2017
Publisher
Free
Excluding VAT
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts.
| DocumentType |
Test Method
|
| Pages |
32
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| MIL-STD-883-1 Base Document:2019 | Environmental Test Methods for Microcircuits Part 1: Test Methods 1000-1999 |
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