JEDEC JESD 51-12.01:2012
Current
Current
The latest, up-to-date edition.
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-11-2012
Publisher
Free
Excluding VAT
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards.
| DocumentType |
Revision
|
| Pages |
28
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| JEDEC JEP30-T100A:2023 | Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
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