JEDEC JESD 51-2A : 2008
Current
Current
The latest, up-to-date edition.
INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - NATURAL CONVECTION (STILL AIR)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-01-2008
Publisher
Free
Excluding VAT
The environmental conditions described in this document will apply only to natural convection, θJA, measurements for packages mounted on standard test boards.
| DocumentType |
Test Method
|
| Pages |
22
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| JEDEC JEP30-T100A:2023 | Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
| DSCC V62/13604B:2023 | MICROCIRCUIT, LINEAR, 2.2 V TO 4 V, 14 A OUTPUT SYNCHRONOUS BUCK PWM SWITCHER WITH INTEGRATED FETS, MONOLITHIC SILICON |
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