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JEDEC JESD22-B102E:2007

Current

Current

The latest, up-to-date edition.

SOLDERABILITY

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-10-2007

Free

This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations.

Committee
JC-14.1
DocumentType
Test Method
Pages
26
PublisherName
JEDEC Solid State Technology Association
Status
Current
SupersededBy

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