JEDEC JESD22-B116C:2026
Current
The latest, up-to-date edition.
Wire Bond Shear Test Method
Hardcopy , PDF
English
01-08-2026
This test method provides a means for determining the strength of thermosonic ball bonds and ultrasonic wedge bonds (here fore to be called ball bonds and wedge bonds) to a die or package bonding surface and may be performed on unencapsulated and decapsulated devices.
| DocumentType |
Test Method
|
| Pages |
44
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : Users cannot be edited or removed once added to your Multi user PDF.