JEDEC JESD238B.01:2025
Current
Current
The latest, up-to-date edition.
High Bandwidth Memory (HBM3) DRAM
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-04-2025
Publisher
Free
Excluding VAT
The HBM3 DRAM is tightly coupled to the host compute die with a distributed interface.
| DocumentType |
Standard
|
| Pages |
274
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
Summarise
Free
Excluding VAT
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