JEDEC JP001 : 2014
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
30-07-2018
17-12-2022
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Standard
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| PublisherName |
JEDEC Solid State Technology Association
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Superseded
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This document describes test and data methods for the qualification of semiconductor technologies. Itdoes not give pass or fail values or recommend specific test equipment, test structures or test algorithms.Wherever possible, it references applicable JEDEC, such as JESD47, or other widely accepted standardsfor requirements documentation.There are two levels of qualification described. Level 1 is a pure process qualification intended to findreliability weaknesses. It primarily addresses technology wearout mechanisms through package or waferlevel reliability tests on specially designed test structures.Level 2 demonstrates the reliability of the process that corresponds to the reliability demands fromprojected or known applications. Level 2 testing can be implemented via the testing of a relevantfunctional technology qualification vehicle (TQV), including life test. The level 2 tests are described inclause 12. Other Reporting requirements (e.g., PCM data) are also included.
| CEI EN IEC 63287-2:2023 | Semiconductor devices - Guidelines for reliability qualification plans Part 2: Concept of mission profile |
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