JESD22-A111B:2018
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-03-2018
Publisher
Superseded date
13-01-2026
Free
Excluding VAT
This evaluation procedure is written to provide users of ICs of small surface mount packages with a method to evaluate the capability of a device to withstand full wave solder immersion.
| Committee |
JC-14.1
|
| DocumentType |
Revision
|
| Pages |
22
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| Supersedes |
| JEDEC JEP30-A100A:2023 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
Summarise
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