JIS C 0054:2002
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
English
30-04-2002
20-03-2004
This Standard outlines test Td, applicable to surface mounting devices (SMD). Soldering tests applicable to SMD in IEC 60068-2-69 and to other electrotechnical products are in JIS C 0050 and JIS C 0053, for which guidance is given in IEC 60068-2-44. This Standard provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD). The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.
| DocumentType |
Standard
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| Pages |
0
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| ProductNote |
This standard is also refers to C0050.
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| PublisherName |
Japanese Standards Association
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| Status |
Withdrawn
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| SupersededBy | |
| Supersedes |
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