JIS C 2250:2008
Current
Current
The latest, up-to-date edition.
General rules for electrical insulating mica products
Available format(s)
PDF
Language(s)
English
Published date
20-02-2008
Publisher
€33.62
Excluding VAT
This Standard gives terms and definitions used to describe built-up mica based on mica splittings or mica paper. It also deals with general requirements and conditions of supply.
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60371-1:2003 | Identical |
Reaffirmed 2017
| JIS C 2116:2004 | Methods of test for electrical insulating materials based on mica |
| JIS C 2265:2007 | Plastic film or nonwoven fabric backed mica paper for electrical insulation for post-impregnation (VPI) |
| JIS C 2263:2007 | Glass-backed mica paper for electrical insulation with a B-stage epoxy resin binder |
| JIS C 2264:2007 | Polyester film-backed mica paper for electrical insulation with a B-stage epoxy resin binder |
| JIS C 2262:2007 | Glass-backed mica paper for electrical insulation with resin binder for post-impregnation (VPI) |
| JIS C 2255:1992 | Flexible mica materials |
| JIS C 2254:2004 | Rigid mica materials for electric heating equipment |
| JIS C 2220:2008 | Mica paper for electrical insulating materials |
| JIS C 2220:2008 | Mica paper for electrical insulating materials |
| JIS C 2262:2007 | Glass-backed mica paper for electrical insulation with resin binder for post-impregnation (VPI) |
| JIS C 2264:2007 | Polyester film-backed mica paper for electrical insulation with a B-stage epoxy resin binder |
| JIS C 2255:1992 | Flexible mica materials |
| JIS C 2254:2004 | Rigid mica materials for electric heating equipment |
| JIS C 2265:2007 | Plastic film or nonwoven fabric backed mica paper for electrical insulation for post-impregnation (VPI) |
| JIS C 2116:2004 | Methods of test for electrical insulating materials based on mica |
| JIS C 2263:2007 | Glass-backed mica paper for electrical insulation with a B-stage epoxy resin binder |
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