JIS C 5018:2023
Current
Current
The latest, up-to-date edition.
Evaluation method of flexible printed wiring boards for creasing and expanding processes
Available format(s)
Hardcopy
Language(s)
Japanese
Published date
20-02-2023
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| JIS C 60068-1:2016 | Environmental Testing - Part 1: General And Guidance |
| JIS C 5603:1993 | Terms and definitions for printed circuits<br> |
| JIS C 6471:1995 | Test methods of copper-clad laminates for flexible printed wiring boards |
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