JIS C 5070:2002
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Hardcopy , PDF
23-12-2016
English, Japanese
01-10-2002
This Japanese Industrial Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this Standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause determination, and result in assembly problems such as poor solderability, delamination and "popcorning".
| DocumentType |
Standard
|
| Pages |
5
|
| PublisherName |
Japanese Standards Association
|
| Status |
Superseded
|
| SupersededBy |
| JIS C 0806-3:1999 | Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes |
| JIS C 60721-3-2:2001 | Classification of environmental conditions Part 3: Classification of groups of environmental parameters and their severities Section 2: Transportation |
| JIS C 60721-3-1:1997 | Classification of environmental conditions Part 3: Classification of groups of environmental parameters and their severities Storage |
| JIS C 61191-1:2006 | Printed Board Assemblies - Part 1: Generic Specification - Requirements For Soldered Electrical And Electronic Assemblies Using Surface Mount And Related Assembly Technologies |
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