IntroductionSection 1 - Scope1 ScopeSection 2 - General2 General 2.1 Normative references 2.2 Units, symbols and terminology 2.3 Preferred values 2.4 MarkingSection Three - Quality assessment procedures3 Quality assessment procedures 3.1 Qualification approval/quality assessment systems 3.2 Primary stage of manufacture 3.3 Structurally similar components 3.4 Qualification approval procedures 3.5 Quality conformance inspection 3.6 Alternative test methods 3.7 Unspecified parametersSection Four - Test and measurement procedures4 Procedures of test and measurement 4.1 General 4.2 Standard atmospheric conditions 4.3 Drying 4.4 Visual examination and check of dimensions 4.5 Continuity (except for continuously rotating potentiometers) 4.6 Element resistance 4.7 Terminal resistance (Minimum resistance) 4.8 Maximum attenuation [Alternave (when specified) to terminal resistance] 4.9 Resistance law 4.10 Matching of the resistance law (for ganged potentiometers only) 4.11 Switch contact resistance (when applicable) 4.12 Voltage proof 4.13 Insulation resistance 4.14 Variation of resistance with temperature 4.15 Rotational noise 4.16 Contact resistance at low-voltage levels 4.17 Setting ability (adjustability) 4.18 Starting torque 4.19 Switch torque 4.20 End stop torque 4.21 Locking torque 4.22 Thrust and pull on spindle 4.23 Spindle run-out 4.24 Lateral run-out 4.25 Spigot diameter run-out 4.26 Spindle end play 4.27 Backlash 4.28 Dither 4.29 Output smoothness 4.30 Robustness of terminations 4.31 Sealing 4.32 Solderability (In case of surface mounting, the provision of 4.50 shall be applied) 4.33 Resistance to soldering heat (In case of surface mounting, the provision of 4.51 shall be applied) 4.34 Change of temperature 4.35 Vibration (Sinusoidal) 4.36 Bump 4.37 Shock 4.38 Climatic sequence 4.39 Damp heat (steady state) 4.40 Mechanical endurance 4.41 A.C. endurance testing of mains switches on capacitive loads 4.42 D.C. endurance testing of switches 4.43 Electrical endurance 4.44 Component solvent resistance 4.45 Solvent resistance of the marking 4.46 Microlinearity 4.47 Mounting (Applicable only for surface mounting semi fixed potentiometer) 4.48 Adhesion (Applicable only for surface mounting semi fixed potentiometer) 4.49 Bond strength of the face plating (Applicable only for surface mount semi fixed potentiometer) 4.50 Solderability (Applicable only for surface mount fixed potentiometer) 4.51 Resistance to soldering heat (Applicable only to surface mount semi fixed potentiometer)Annex A (normative) Rules for the preparation of detailspecifications for capacitors and resistors for electronicequipmentAnnex B (normative) Interpretation of sampling plans and procedures as described in IEC 60410 for use within the IECQuality Assessment System for electronic componentsAnnex C (normative) A suitable method for measuringrotational noiseAnnex D (normative) Apparatus for measuring mechanical accuracyAnnex E (normative) Measuring method for microlinearityAnnex 1 (normative) Type designation and markingAnnex 2 (normative) Recommended dimensions of spindle andmounting part of potentiometer