JIS C 5630-12:2014
Current
Current
The latest, up-to-date edition.
Semiconductor devices -- Micro-electromechanical devices -- Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Published date
20-02-2014
Publisher
Sorry this product is not available in your region.
| DocumentType |
Standard
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-12:2011 | Identical |
2014 [20/02/2014]
Summarise
Sorry this product is not available in your region.