JIS C 60068-2-58:2002
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Hardcopy , PDF
29-07-2010
English
01-01-2003
This Standard outlines test Td, applicable to surface mounting devices (SMD). Soldering tests applicable to SMD in IEC 60068-2-69 and to other electrotechnical products are in JIS C 0050 and JIS C 0053, for which guidance is given in IEC 60068-2-44. This Standard provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD). The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.
| DocumentType |
Standard
|
| Pages |
21
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| PublisherName |
Japanese Standards Association
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| Status |
Superseded
|
| SupersededBy |
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