JIS C 61760-3:2022
Current
Current
The latest, up-to-date edition.
Surface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) solderingSurface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Available format(s)
Hardcopy
Language(s)
Japanese
Published date
22-08-2022
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| DocumentType |
Standard
|
| Pages |
44
|
| ProductNote |
This standard also refers to C60068 series, C60068 seriesv,
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61760-3:2021 | Identical |
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