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JIS C 61760-3:2022

Current

Current

The latest, up-to-date edition.

Surface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

Published date

22-08-2022

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DocumentType
Standard
ProductNote
This standard also refers to C60068 series, C60068 seriesv,
PublisherName
Japanese Standards Association
Status
Current

Standards Relationship
IEC 61760-3:2021 Identical

Sorry this product is not available in your region.