JIS C 61760-3:2022
Current
Current
The latest, up-to-date edition.
Surface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published date
22-08-2022
Publisher
Sorry this product is not available in your region.
| DocumentType |
Standard
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61760-3:2021 | Identical |
Summarise
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